Polyimide film
Kapton®
DU PONT-TORAY CO., LTD.
Language
- English
- 日本語
Kapton® film can be purchased under the 
Ordering in not only in whole roll width units, but also in smaller slit rolls and cut sheets, is possible.
Detailed Product Information
H type
| Product No. | Thickness | Color | Features |
|---|---|---|---|
| 50H | 12.5μm | Transparent gold | Heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 100H | 25μm | Transparent gold | Heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 200H | 50μm | Transparent gold | Heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 300H | 75μm | Transparent gold | Heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 500H | 125μm | Transparent gold | Heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
Special characteristics
- With excellent heat resistance, the same mechanical properties at room temperature are maintained even at high temperatures.
- Flame resistance without a melting point, carbonization only begins at temperatures above 800°C.
- Extremely high LOI (oxygen exponent) among organic materials and non-extinguishability.
- Does not melt in most organic solvents, and shows high resistance to chemicals even at high temperatures.
- Excellent electrical characteristics, including high breakdown voltage, small dielectric loss tangent, are retained over a wide temperature and frequency range.
Purpose of use
- Flexible print circuit board (FPC), All-polyimide circuit materials (two-layer FPC), FPC Coverlay films, Reinforcement plate for FPC (stiffener), Applications for semiconductors, Electrical insulation materials
V type
| Product No. | Thickness | Color | Features |
|---|---|---|---|
| 50V | 12.5μm | Transparent gold | High dimensional stability, low thermal shrinkage, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 100V | 25μm | Transparent gold | High dimensional stability, low thermal shrinkage, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 200V | 50μm | Transparent gold | High dimensional stability, low thermal shrinkage, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 300V | 75μm | Transparent gold | High dimensional stability, low thermal shrinkage, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 500V | 125μm | Transparent gold | High dimensional stability, low thermal shrinkage, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
Special characteristics
- Greater dimensional stability than H type
- Small thermal contraction rate
- With excellent heat resistance, the same mechanical properties at room temperature are maintained even at high temperatures.
- Flame resistance without a melting point, carbonization only begins at temperatures above 800°C.
- Extremely high LOI (oxygen exponent) among organic materials and non-extinguishability.
- Does not melt in most organic solvents, and shows high resistance to chemicals even at high temperatures.
- Excellent electrical characteristics, including high breakdown voltage, small dielectric loss tangent, are retained over a wide temperature and frequency range.
Purpose of use
- Flexible print circuit board (FPC), metallized substrate (two-layer FPC, COF), FPC Coverlay film
EN type
| Product No. | Thickness | Color | Features |
|---|---|---|---|
| 20EN | 5μm | Transparent gold | High dimensional stability, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 30EN | 7.5μm | Transparent gold | High dimensional stability, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 50EN | 12.5μm | Transparent gold | High dimensional stability, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 100EN | 25μm | Transparent gold | High dimensional stability, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 150EN | 37.5μm | Transparent gold | High dimensional stability, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
| 200EN | 50μm | Transparent gold | High dimensional stability, heat resistance/cold resistance, flame resistance, non-extinguishability, chemical resistance, electrical insulation capacity |
Special characteristics
- Dramatically improved dimensional stability
- With excellent heat resistance, the same mechanical properties at room temperature are maintained even at high temperatures.
- Flame resistance without a melting point, carbonization only begins at temperatures above 800°C.
- Extremely high LOI (oxygen exponent) among organic materials and non-extinguishability.
- Does not melt in most organic solvents, and shows high resistance to chemicals even at high temperatures.
- Excellent electrical characteristics, including high breakdown voltage, small dielectric loss tangent, are retained over a wide temperature and frequency range.
Purpose of use
- Flexible print circuit board (FPC), all polymide circuit material (two-layer FPC), metallized substrates (two-layer FPC, CPF), FPC coverlay film, semiconductor applications.
List of Properties
Thickness : 25µm
| H type | V type | EN type | ||
|---|---|---|---|---|
| Heat resistance temperature | 300℃ | 300℃ | 300℃ | |
| Strength | MD | 330MPa | 330MPa | 375MPa |
| TD | 330MPa | 330MPa | 400MPa | |
| Elasticity | MD | 80% | 80% | 80% |
| TD | 80% | 80% | 65% | |
| Young's modulus | MD | 3.4GPa | 3.4GPa | 5.3GPa |
| TD | 3.4GPa | 3.4GPa | 5.8GPa | |
| Thermal contraction rate | 0.2% | 0.05% | 0.01% | |
| BDV(Insulation breakdown voltage) | 380kV/mm | 380kV/mm | 380kV/mm | |
| CTE | MD | 27ppm/℃ | 27ppm/℃ | 16ppm/℃ |
| TD | 27ppm/℃ | 27ppm/℃ | 13ppm/℃ | |
Sales conditions adjusted to the request of the client
Various sales conditions can be arranged according to the request of the client. Orders for large and small lots are possible. In some cases, we may not be able to meet your request depending on the product. We appreciate your understanding.
-
Whole roll unit -
Slit rolls -
Sheet products -
Die cut products
FAQs
- Is it possible to order a small lot?
- We will do our best to accommodate your order.
- How long will it take before shipping?
- The shortest time until shipping is 4 business days. However, this will depend on inventory conditions and what processing is needed for the product. Please feel free to ask.
- I would like detailed information regarding a product.
- Reference material for each product is available. Please call or fill out the request form for product information. If you are having difficulty regarding use of a product, we can provide assistance and advice. Please feel free to contact us.
- Is joint development of a new product possible?
- Yes. We will be happy to consider your suggestions.
- Do you accept regular standing orders?
- Please tell us the amount you need in advance, and we will stock the product for you.
This may be difficult for some products. We appreciate your understanding. - Can you send me a sample?
- Yes. Please tell us the purpose of use and we will send you a sample of the appropriate product.
Inquiry・Estimate
Please feel free to contact us regarding any matter, including questions regarding our products or to request an estimate.